The key to using the nail polish grinder correctly lies in the operation of the equipment, the holding technique and the partitioning treatment. It mainly includes the following key steps:
I. Basic operation points
Grinding head installation and testing
When installing the grinding head, 1-2 mm of space should be reserved. After locking, turn on the machine to test the direction: choose the direction with resistance for grinding (invalid direction will slip).
Prioritize the grinding head suitable for the current operation, such as fine sand grinding head for dead skin removal and conical grinding head for nail removal.
Holding and support
Hold the grinder in the posture of holding a pen, keep your wrist stable, and find a support point for your fingers (such as the little finger against the table) to improve the accuracy of the operation.
When grinding, the grinding head and the nail surface are tilted at an angle of 30°-45° to avoid vertical contact (easy to damage the nail surface).
II. Grinding process specifications
Partitioning order
Grind from the back edge to the fingertip, first process the left side and then the right side, and turn the wrist sideways at the edge seam to process with a pointed head.
When removing nail polish, follow the "front edge → both sides → rear edge" method to avoid over-grinding the same area. Speed and direction control
Select the speed according to your needs: medium-high speed (about 15,000-20,000 RPM) for removing nail polish, and low speed (5,000-10,000 RPM) for removing dead skin and polishing.
After turning it on, move along the edge of the finger clockwise or counterclockwise to avoid repeatedly rubbing the same area.
III. Special scene treatment Dead skin and cuticle treatment
After softening the dead skin, use a conical grinding head to push inward from both sides of the edge of the finger, and then use a small grinding head to clean the residual cuticle inside.
If you use a nail skin scissor to assist, you need to moisten the edge of the finger with alcohol first to clearly observe the dead skin boundary.
Techniques for protecting your nails
The glue that has not curled up can retain a thin layer of residual glue as a protective layer, and only needs to be polished until the nail surface is flat.
During the polishing stage, follow the sequence of "black→white→gray" three-color polishing blocks to improve the gloss of the nail surface.
Fourth, common misunderstandings reminder Incorrect grinding head direction: If the debris splashes obviously during polishing, you need to check whether the grinding head rotates in the correct direction. Excessive pursuit of efficiency: High-speed polishing can easily cause the nail surface to overheat. It is recommended to operate in stages and cooperate with cooling.
If you need to go into details, you can further understand the relevant technical parameters such as nail edge care, nail removal partition or sandpaper mesh.
